Daniel F. Baldwin
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- Sorted by Year/Conf, Year/Citation, Citation
| 2005 | ||
|---|---|---|
| 1 | Integrated hardware and software for improved flatness measurement with ATC4.1 flip-chip assembly case study. Hai Ding, I. Charles Ume, Jian Zhang, Daniel F. Baldwin. IEEE T. Instrumentation and Measurement (54): 1898-1904 (2005). Web SearchBibTeXDownload | |
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