Song-bai Xue
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- Sorted by Year/Conf, Year/Citation, Citation
| 2010 | ||
|---|---|---|
| 1 | Reliability study of Sn-Ag-Cu-Ce soldered joints in quad flat packages. Liang Zhang, Song-bai Xue, Li-li Gao, Zhong Sheng, Sheng-lin Yu, Yan Chen, Wei Dai, Feng Ji, Zeng Guang. Microelectronics Reliability 2010, 2071-2077. Web SearchBibTeXDownload | |
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