Sung Kyu Lim
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- Sorted by Year/Conf, Year/Citation, Citation
| 2011 | ||
|---|---|---|
| 2 | Impact of nano-scale through-silicon vias on the quality of today and future 3D IC designs. Daehyun Kim, Suyoun Kim, Sung Kyu Lim. SLIP 2011, 1-8. Web SearchBibTeXDownload | |
| 2010 | ||
| 1 | Through-silicon-via-aware delay and power prediction model for buffered interconnects in 3D ICs. Daehyun Kim, Sung Kyu Lim. SLIP 2010, 25-32. Web SearchBibTeXDownload | |
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