Suyoun Kim
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- Sorted by Year/Conf, Year/Citation, Citation
| 2011 | ||
|---|---|---|
| 1 | Impact of nano-scale through-silicon vias on the quality of today and future 3D IC designs. Daehyun Kim, Suyoun Kim, Sung Kyu Lim. SLIP 2011, 1-8. Web SearchBibTeXDownload | |
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